发明名称 |
Acoustic wave device and method for manufacturing same |
摘要 |
An SAW device (1) has a piezoelectric substrate (3) propagating acoustic waves, and a comb-shaped electrode (6) arranged on a first surface (3a) of the piezoelectric substrate (3). The SAW device (1) has a columnar terminal (15) located on the first surface (3a) and electrically connected to the comb-shaped electrode (6), and a cover member (9) covering a side surface of the terminal (15). The terminal (15) comprises, in a first region in the direction of height thereof, a larger diameter on the side of the first surface (3a) compared with the diameter on the side opposite to the first surface (3a). |
申请公布号 |
US8810111(B2) |
申请公布日期 |
2014.08.19 |
申请号 |
US200913131854 |
申请日期 |
2009.11.24 |
申请人 |
Kyocera Corporation |
发明人 |
Fukano Toru;Nishii Junya |
分类号 |
H03H9/25;H01L41/09 |
主分类号 |
H03H9/25 |
代理机构 |
DLA Piper LLP (US) |
代理人 |
DLA Piper LLP (US) |
主权项 |
1. An acoustic wave device, comprising:
a substrate configured to propagate acoustic waves; an excitation electrode located on a surface of the substrate; a connection-use conductor located on the surface of the substrate and electrically connected to the excitation electrode; a terminal of with a pillar-shaped located on the surface of the substrate, electrically connected to the connection-use electrode and comprising a first region in the direction of height thereof with a cross-sectional area of a surface side larger than a cross-sectional area of an opposite side with respect to the surface; and a cover member covering a side surface of the first region of the terminal. |
地址 |
Kyoto JP |