发明名称 Acoustic wave device and method for manufacturing same
摘要 An SAW device (1) has a piezoelectric substrate (3) propagating acoustic waves, and a comb-shaped electrode (6) arranged on a first surface (3a) of the piezoelectric substrate (3). The SAW device (1) has a columnar terminal (15) located on the first surface (3a) and electrically connected to the comb-shaped electrode (6), and a cover member (9) covering a side surface of the terminal (15). The terminal (15) comprises, in a first region in the direction of height thereof, a larger diameter on the side of the first surface (3a) compared with the diameter on the side opposite to the first surface (3a).
申请公布号 US8810111(B2) 申请公布日期 2014.08.19
申请号 US200913131854 申请日期 2009.11.24
申请人 Kyocera Corporation 发明人 Fukano Toru;Nishii Junya
分类号 H03H9/25;H01L41/09 主分类号 H03H9/25
代理机构 DLA Piper LLP (US) 代理人 DLA Piper LLP (US)
主权项 1. An acoustic wave device, comprising: a substrate configured to propagate acoustic waves; an excitation electrode located on a surface of the substrate; a connection-use conductor located on the surface of the substrate and electrically connected to the excitation electrode; a terminal of with a pillar-shaped located on the surface of the substrate, electrically connected to the connection-use electrode and comprising a first region in the direction of height thereof with a cross-sectional area of a surface side larger than a cross-sectional area of an opposite side with respect to the surface; and a cover member covering a side surface of the first region of the terminal.
地址 Kyoto JP