Apparatus integrating microelectromechanical system device with circuit chip and methods for fabricating the same

摘要

One embodiment discloses an apparatus integrating a microelectromechanical system device with a circuit chip which comprises a circuit chip, a microelectromechanical system device, a sealing ring, and a lid. The circuit chip comprises a substrate and a plurality of metal bonding areas. The substrate has an active surface with electrical circuit area, and the metal bonding areas are disposed on the active surface and electrically connected to the electrical circuits. The microelectromechanical system device comprises a plurality of bases and at least one sensing element. The bases are connected to at least one of the metal bonding areas. The at least one sensing element is elastically connected to the bases. The sealing ring surrounds the bases, and is connected to at least one of the metal bonding areas. The lid is opposite to the active surface of the circuit chip, and is connected to the sealing ring to have a hermetic chamber which seals the sensing element and the active surface of the circuit chip.

主权项

1. An apparatus integrating a microelectromechanical system device with a circuit chip, the apparatus comprising:
a circuit chip comprising:
a substrate having an active surface with at least one electrical circuit area; anda plurality of metal bonding areas disposed on the active surface and electrically connected to the electrical circuit area; a microelectromechanical system device comprising:
a plurality of bases connected to at least one of the metal bonding areas;at least one sensing element elastically connected to the bases; anda sealing ring surrounding the bases and connected to at least one of the metal bonding areas; and a lid being opposite to the active surface of the circuit chip, and connected to the sealing ring so as to form a hermetic chamber surrounding the at least one sensing element, wherein the microelectromechanical system device further comprises a plurality of supporting bases connected to at least one of the metal bonding areas, wherein the sealing ring comprises an insulating layer, two silicon layers clipping the insulating layer and a plurality of conductive pillars penetrating the insulating layer, wherein the material of the lid is a conductive material, and the lid is electrically connected to the metal bonding area of the circuit chip by the electrical path through the sealing ring and the conductive pillar.