发明名称 Method for applying hot melt adhesive powder onto a shoe or sole part
摘要 A method for applying hot melt adhesive powder onto a sole or shoe part includes the steps of applying a cleaning agent, irradiating, applying a conductive liquid which has a conductivity at least 100 times higher than purified water which has a conductivity of 5.5·10−6 S/m, spraying hot melt adhesive powder; and heating. The method can save energy, reduce the working space, reduce the labor intensity and improve the working environment by continuously carrying out the spraying and the melting operation of the hot melt adhesive.
申请公布号 US8808809(B2) 申请公布日期 2014.08.19
申请号 US201314014143 申请日期 2013.08.29
申请人 Orisol Asia Ltd. 发明人 Makover Jakov;Mardix Bar Cochva;Sadeh Yaacov
分类号 B05D1/06;B05D5/10;A43D25/20;A43D111/00;A43D117/00;A43D25/18;B29L31/50 主分类号 B05D1/06
代理机构 代理人 Shia Banger
主权项 1. A method for applying hot melt adhesive powder onto a sole or shoe part comprising the steps of: applying a cleaning agent onto a surface of a to-be-bonded shoe; placing the to-be-bonded shoe in a irradiation chamber and irradiating the surface of the to-be-bonded shoe which has been treated by the previous step with UVC and ozone; applying conductive liquid which has a conductivity at least 100 times higher than purified water having a conductivity of 5.5·10−6 S/m onto the surface of the to-be-bonded shoe which has been treated by the previous steps; placing the to-be-bonded shoe in a spraying chamber and spraying charged hot melt adhesive powder on the surface of the to-be-bonded shoe which has been treated by the previous steps to make the charged hot melt adhesive powder attached onto the to-be-bonded area of the to-be-bonded shoe; and heating the surface of the to-be-bonded shoe which has been treated by the previous steps by placing the to-be-bonded shoe in a heating chamber to melt the hot melt adhesive powder.
地址 Chang Hwa TW