发明名称 Reverse block-type insulated gate bipolar transistor manufacturing method
摘要 A reverse block-type insulated gate bipolar transistor (IGBT) manufacturing method that, when manufacturing a reverse block-type IGBT having a separation layer formed along tapered surfaces of a V-shaped groove formed using anisotropic etching, can secure a highly reliable reverse pressure resistance, and suppress a leakage current when reverse biasing. When irradiating with a flash lamp for flash lamp annealing after implantation of ions into a second conductivity type separation layer and second conductivity type collector layer to form the second conductivity type collector layer and second conductivity type separation layer, the strongest portion of radiation energy is focused on a depth position from the upper portion to the central portion of a tapered side edge surface.
申请公布号 US8809130(B2) 申请公布日期 2014.08.19
申请号 US201313911685 申请日期 2013.06.06
申请人 Fuji Electric Co., Ltd. 发明人 Nakazawa Haruo;Kubouchi Motoyoshi;Teranishi Hideaki;Shimizu Hideo
分类号 H01L21/00 主分类号 H01L21/00
代理机构 代理人
主权项 1. A reverse block-type insulated gate bipolar transistor manufacturing method, comprising: forming a MOS gate structure on one main surface of a first conductivity type semiconductor substrate; forming a second conductivity type collector layer on an other main surface; forming a second conductivity type separation layer, along a tapered side edge surface formed by etching from either one of the main surfaces to the other main surface, that links the two main surfaces with a layer of the same conductivity type, and is connected to the second conductivity type collector layer of the other main surface; and forming each of an emitter metal electrode on the MOS gate structure side and a collector metal electrode on the second conductivity type collector layer side, wherein when irradiating with a flash lamp for a flash lamp annealing after an implantation of ions into the second conductivity type separation layer and second conductivity type collector layer to form the second conductivity type collector layer and second conductivity type separation layer, the strongest portion of the radiation energy is focused on a depth position from the upper portion to the central portion of the tapered side edge surface.
地址 Kawasaki JP