Reducing thermal expansion effects in semiconductor packages

摘要

Reducing effects of thermal expansion in electronic components. An electronic device can include a support, such as a leadframe. An electronic component can be supported by the support. A first flexible layer can cover the electronic component. A second more rigid layer can cover the first layer. The first layer can be made from a material that is more flexible than the second layer thereby creating a mechanical buffer layer between the second layer and the electronic component such that the electronic component is protected from thermal expansion of the second portion caused by changes in temperature. The electronic component can be a laser. The first and second materials can be selected to disperse an optical emission from the optical transmitter.

主权项

1. A method for manufacturing an electronic device comprising:
coupling an electronic component to a top surface of a support that is directly opposite from and substantially parallel to a bottom surface of the support; selecting a first material and a second material; using the first material to produce a first layer over the electronic component, the first layer substantially encasing, and in direct physical contact with, all exposed surfaces of the electronic component, the first layer including a dye for identifying cracks in the electronic device, the dye being transmissive to optical emissions and not visually apparent except when illuminated by blue light; and using the second material to produce a second layer over the first layer, the second layer substantially encasing, and in direct physical contact with, a portion of the bottom surface of the support that is directly opposite from the electronic component; wherein the first material and the second material are selected such that the first material is more flexible than the second material, and a thickness of the first layer is selected to form a mechanical buffer layer configured to absorb stresses caused by thermal expansion of the second layer.