发明名称 METHOD FOR SIMULATION OF THERMAL FAILURE AND METHOD FOR MEASURE THERMAL OF ELECTRONIC DEVICE USED IN LOW EARTH ORBIT SATELLITE
摘要 Disclosed are a thermal measurement method of an electronic device for a low earth orbit-satellite and a terminal fault simulation method. The thermal measurement method of the electronic device according to the present invention comprises a step of measuring the temperature of a case of an electronic component; a step of receiving a thermal resistance value from the junction of the electronic component to the case; a step of receiving a power loss value of the electronic component; and a step of calculating the junction temperature of the electronic component by using the measured temperature of the case, the thermal resistance value, and the power loss value.
申请公布号 KR101431109(B1) 申请公布日期 2014.08.19
申请号 KR20130016308 申请日期 2013.02.15
申请人 KOREA AEROSPACE INDUSTRIES, LTD. 发明人 SEO, HYUN SEOK
分类号 G01R31/04;G01K7/02;G01R31/02 主分类号 G01R31/04
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