发明名称 |
METHOD FOR SIMULATION OF THERMAL FAILURE AND METHOD FOR MEASURE THERMAL OF ELECTRONIC DEVICE USED IN LOW EARTH ORBIT SATELLITE |
摘要 |
Disclosed are a thermal measurement method of an electronic device for a low earth orbit-satellite and a terminal fault simulation method. The thermal measurement method of the electronic device according to the present invention comprises a step of measuring the temperature of a case of an electronic component; a step of receiving a thermal resistance value from the junction of the electronic component to the case; a step of receiving a power loss value of the electronic component; and a step of calculating the junction temperature of the electronic component by using the measured temperature of the case, the thermal resistance value, and the power loss value. |
申请公布号 |
KR101431109(B1) |
申请公布日期 |
2014.08.19 |
申请号 |
KR20130016308 |
申请日期 |
2013.02.15 |
申请人 |
KOREA AEROSPACE INDUSTRIES, LTD. |
发明人 |
SEO, HYUN SEOK |
分类号 |
G01R31/04;G01K7/02;G01R31/02 |
主分类号 |
G01R31/04 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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