| 发明名称 | Silicon chicklet pedestal | ||
| 摘要 | A silicon chicklet pedestal for use in a wafer-level test probe of a wafer is provided and includes a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another. | ||
| 申请公布号 | US8806740(B2) | 申请公布日期 | 2014.08.19 |
| 申请号 | US201113095969 | 申请日期 | 2011.04.28 |
| 申请人 | International Business Machines Corporation | 发明人 | Chey S. Jay;Krywanczyk Timothy C.;Shaikh Mohammed S.;Tiersch Matthew T.;Tsang Cornelia Kang-I |
| 分类号 | H01R43/00;G01R3/00;G01R1/073 | 主分类号 | H01R43/00 |
| 代理机构 | Cantor Colburn LLP | 代理人 | Cantor Colburn LLP ;Alexanian Vazken |
| 主权项 | 1. A silicon chicklet pedestal, for use in a wafer-level test probe for a wafer, including a main body, first and second opposing faces, and an array of vias formed through the main body to extend between the first and second faces, through which pairs of leads, respectively associated with each via at the first and second faces, are electrically connectable to one another, the silicon chicklet pedestal further comprising insulation, a conductive layer disposed on the insulation and a curable filling at each of the vias. | ||
| 地址 | Armonk NY US | ||