| 摘要 |
Disclosed herein are a printed circuit board including a copper foil layer surface treated with Pb-free solder having the same height as that of a solder resist, and a surface treatment method of the printed circuit board. According to the present invention, the surface treatment of the package board or interposer board having an ultra-fine pitch (300μm or less) may be easily implemented by a cheap process. In addition, the surface treatment of the printed circuit board may be eco-friendly performed by using the Pb-free solder, and it may be easy to surface treat the package board or interposer board based on the organic material sensitive to a high temperature. |
