Power and ground planes in package substrate

摘要

A semiconductor package includes a plurality of electrical connectors, a semiconductor die having core logic, at least two pairs of core logic input-power and output-power pads, and a plurality of input/output signal pads that carry signals to and from the core logic. Each pad of the semiconductor die has an electrical connector of the plurality of electrical connectors extending therefrom. The semiconductor package also includes a package substrate having at least two pairs of input-power and output-power contact pads, a plurality of input/output signal contact pads, a first metal redistribution layer, and a second metal redistribution layer. The first metal redistribution layer provides a first electrical potential to each of the input-power contact pads, and the second metal redistribution layer provides a second electrical potential to each of the output-power contact pads. Each contact pad has an electrical connector of the plurality of electrical connectors extending therefrom.

主权项

1. A package substrate comprising:
a plurality of signal contact pads; a first pair of power contact pads comprising (i) a first input-power contact pad and (ii) a first output-power contact pad; a second pair of power contact pads comprising (i) a second input-power contact pad and (ii) a second output-power contact pad; a first metal redistribution layer; and a second metal redistribution layer, wherein the first metal redistribution layer is configured to provide a first electrical potential to each of (i) the first input-power contact pad and (ii) the second input-power contact pad, and wherein the second metal redistribution layer is configured to provide a second electrical potential to each of (i) the first output-power contact pad and (ii) the second output-power contact pad.