Structure of stacking chips and method for manufacturing the same

摘要

A structure of stacking chips and a method for manufacturing the structure of stacking chips are provided. A wafer with optical chips and a glass substrate with signal processing chips are stacked with each other, and then subjected to ball mounting and die sawing to form the stacked packaging structure. The optical chips and the signal processing chips form the electrical connection on the surface of the glass substrate via the through holes thereof.

主权项

1. A method of manufacturing a structure of stacking chips, comprising:
forming a plurality of cavities on a first surface of a glass substrate according to a predetermined layout, wherein the cavities are recessed inside the first surface of the glass substrate; forming a plurality of through holes on the glass substrate and plating a metal on an inner surface of each of the through holes, wherein the through holes pass through the glass substrate; disposing a plurality of multiple signal processing chips respectively in the cavities and each of the signal processing chips is electrically connected with the inner surface of each of the through holes; forming a plurality of optical chips on a wafer; and stacking the wafer and the glass substrate so that the optical chips and the signal processing chips are electrically connected via the respective through holes.