发明名称 Electronic apparatus
摘要 The inner edge of a hole 23 surrounding the outer circumference of a first heat sink 61 includes two edges 23a and 23b that are positioned on opposite sides to each other with the first heat sink 61 therebetween. An upper frame (shield) 20 includes spring portions 24 on one edge 23a, which is in contact with the first heat sink 61 to push the first heat sink 61 toward the other edge 23b. Further, the upper frame 20 includes, the other edge 23b, a position determining portion 25 to which the first heat sink 61 is pressed. According to the above electronic apparatus, it is possible to define the position of a metallic component by a shield covering a circuit board and to cause the metallic component and the shield to be in contact stably.
申请公布号 US8811018(B2) 申请公布日期 2014.08.19
申请号 US201213449592 申请日期 2012.04.18
申请人 Sony Corporation;Sony Computer Entertainment Inc. 发明人 Ikeda Kensuke;Inoue Yukito;Aoki Keiichi
分类号 H05K7/20 主分类号 H05K7/20
代理机构 Katten Muchin Rosenman LLP 代理人 Katten Muchin Rosenman LLP
主权项 1. An electronic apparatus comprising: a circuit board; a plate-like shield covering the circuit board; a metallic component arranged on the circuit board; an edge formed in the shield and surrounding an outer circumference of the metallic component, the edge including two edges that are positioned on opposite sides to each other with the metallic component positioned therebetween; a spring portion formed on one edge of the two edges and in contact with the metallic component to push the metallic component toward the other edge; and a rigid position determining portion formed on the other edge, the metallic component is pressed against the position determining portion.
地址 Tokyo JP