| 摘要 |
A device for removing air in the via hole of a semiconductor is disclosed. The air removing device comprises a wafer chuck supporting the rear side of a wafer; a chuck rotating part rotating the wafer chuck; a liquid injecting device injecting a liquid for removing air at the surface of the wafer fixed at the wafer chuck; a chamber sealing device sealing a chamber surrounding the wafer fixed at the wafer chuck; and a chamber vacuum device forming the inside of the chamber in a vacuum state. The present invention stably removes air remaining at the via hole while simultaneously performing air removal and drying with one instrument. |
