| 摘要 |
The present invention relates to a composite material for a heat sink. More particularly, multiple powder having a wide particle size distribution generated during the course of SiC powder acquisition are used as a heat sink material instead of an expensive process of the related art in which multiple particles are provided type by type so that price competitiveness can be increased and not a simple surface but an inner pore area can be widened, water glass, silica sol base, and ceramic coating types allowing low-temperature sintering that are inorganic materials and room temperature-hardened materials are used to lower a sintering temperature for lower costs, a material in which SiC, flaky graphite, and an inorganic adhesive are mixed is heat-treated at a temperature of 400°C that is a carbon-removing temperature so that pore formation and inorganic material adhesion can be performed at the same time, application is possible to IC, processor-mounted LCD TV, LED Tv, PC monitor, laptop PC, mobile phone, navigation system, set top box, LCD display device, LED display device, automobile exhaust purification DPF filter, and the like for a wide range of application, a heat dissipation area is maximized by the wide surface area and fine surface pore structure, excellent heat dissipation and thin thickness are provided for space saving with a very large heat dissipation area per unit area, and characteristics suitable for a heat expansion rate and a heat conductivity rate required in electronics components and products can be obtained. |
