摘要 |
<p>Binder comprises 35-54 vol.% of a polymeric base, 40-55 vol.% of a wax mixture, and 10 vol.% of a surfactant. The polymeric base contains copolymers of ethylene and methacrylic or acrylic acid, copolymers of ethylene and vinyl acetate, or copolymers of ethylene comprising maleic anhydride or mixture of these copolymers, as well as polyethylene, polypropylene and acrylic resin. An independent claim is included for an injection molding composition, preferably feedstock, comprising 76-96 wt.% of an inorganic powder, and 4-24 wt.% of the binder.</p> |