| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an inexpensive resin paste composition which is suitably used for bonding a conductor element such as a semiconductor chip and a support member such as a lead frame to each other and is excellent in electrical conductivity, thermal conductivity, adhesiveness, coating workability, and mechanical characteristics while reducing the amount of silver used that is a material having a high scarcity value and being expensive, and to provide a semiconductor device using the resin paste composition.SOLUTION: The resin paste composition for bonding a conductor element contains (A) a (meth)acrylic compound, (B) a binder resin, (C) an amine compound, (D) a polymerization initiator, (E) a flexibilizing agent, (F) a silver powder, and (G) an aluminum powder. The content of the silver powder (F) in the resin paste composition is 40 mass% or less. The mass ratio of the aluminum powder (G) to the silver powder (F) is 0.8-3.5. The silver powder (F) contains a first silver powder having a tap density of 2.5 g/100 cm. The content of the first silver powder in the resin paste composition is 5 mass% or more. The semiconductor device uses the resin paste composition for bonding a conductor element.</p> |
