| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a wiring board which achieves improvement in connection reliability between an interlayer connection conductor and a conductor pattern to obtain a low-resistance interlayer connection conductor, and inhibits fluctuation in resistance value.SOLUTION: Provided is a wiring board 10 which includes interlayer connection conductors 31, 32 each formed by a metal conductor formed by punching of a metal sheet and which eliminates the risk of re-melting of the whole of the interlayer connection conductors 31, 32 as in the past when the wiring board 10 is heated by reflow and the like thereby to achieve improvement in connection reliability between each of the interlayer connection conductors 31, 32 and a conductor pattern 22a. In addition, provided is the wiring board 10 which includes interlayer connection conductors 31, 32 each having a smaller resistance value compared with the past and which inhibits thermal expansion of each of the interlayer connection conductors 31, 32 in a heating cycle of the wiring board 10 thereby to inhibit fluctuation in resistance value of each of the interlayer connection conductors 31, 32 and achieve low-resistance interlayer connection conductors 31, 32 and inhibit fluctuation in resistance value.</p> |
