| 摘要 |
Provided is a semiconductor device (1), wherein: a lower side chip (20) has a square region (32), and a first connection terminal group (26) provided in a linear region (34) that includes a region that extends from the square region along one side; an upper side chip (10) has a second connection terminal group (12); and the upper side chip (10) and the lower side chip (20) are disposed so that at least portions of the first and second connection terminal groups (26, 12) overlap, at least portions of the first and second connection terminal groups (26, 12) being electrically connected to each other. |
