| 摘要 |
<p>The present invention relates to a circuit board (10) for an electronic device (100), the circuit board (10) comprising an insulating substrate (1) and a conducting layer (2) arranged at one side of the substrate (1), characterized in that the conducting layer (2) includes an electrode region (21) and at least one heat dissipation region (22) that is separated from the electrode region (21), wherein at least one through hole (23) is opened in the heat dissipation region (22), and at least one electrically isolated heat-conductive structure is provided between the electrode region (21) and the at least one heat dissipation region (22).</p> |
