| 摘要 |
PROBLEM TO BE SOLVED: To provide a jig for manufacturing an electronic device which can suppress bonding failure, in the bonding of a mounting structure and a lid in high vacuum, and to provide a method of manufacturing an electronic device.SOLUTION: A jig for manufacturing an electronic device includes a first jig plate 1 which includes a mounting region 1a for mounting a first member 3, that is one of a mounting structure 10 including a wiring board 11 and a mounted electronic component 12 and a lid 13, and a second jig plate 2 which includes a holding part 2a for holding the other second member 4, and is arranged to face the first jig plate 1. A through hole 5 through which the radiation heat for heating the first member 3 or second member 4 passes is provided in at least one of the mounting region 1a of the first jig plate 1, and the holding part 2a of the second jig plate 2. |
