发明名称 PHOTOELECTRIC CONVERSION SUB-MOUNT SUBSTRATE
摘要 PROBLEM TO BE SOLVED: To provide a photoelectric conversion sub-mount substrate capable of preventing an excess of an under-fill from covering a wiring pad.SOLUTION: The photoelectric conversion sub-mount substrate includes: a substrate 1; an optical waveguide 4 including a core layer 2 and a clad layer 3; an optical element 5 which is optically coupled with the optical waveguide 4; an under-fill 6 which is filled in a gap between the optical element 5 and the optical waveguide 4; and a wiring pad 10 formed on the surface of the substrate 1. The substrate 1 has a flow-out preventing part 22 (projection 23) formed thereon to prevent an excess of the under-fill 6 flowing out from the gap between the optical element 5 and the optical waveguide 4 from reaching the wiring pad 10. In a space enclosed by the projection 23, a dripping space 14 of the under-fill 6, a filling space 15 of the under-fill 6, and a first flow path 16A through which the under-fill 6 flows are formed.
申请公布号 JP2014145947(A) 申请公布日期 2014.08.14
申请号 JP20130014937 申请日期 2013.01.30
申请人 PANASONIC CORP 发明人 TOMOIDA AKIRA;KINUGASA YUTAKA;YAMAJI TADAHIRO
分类号 G02B6/122;G02B6/42;H01L31/0232;H01L33/62 主分类号 G02B6/122
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