发明名称 |
LED ELEMENT PLACING MEMBER AND LED ELEMENT PLACING SUBSTRATE AND MANUFACTURING METHOD OF THOSE, AND LED ELEMENT PACKAGE AND MANUFACTURING METHOD OF THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide an LED placing member and a manufacturing method of the same, and an LED element package and a manufacturing method of the same, which achieves a thin LED element package and enables control of a reflection direction of light from an LED element.SOLUTION: An LED element placing member 20 for placing an LED element 11 comprises: an LED element placing region 21 located in the center; and a peripheral region 22 located on a peripheral border of the LED element placing region 21. The LED element placing region 21 and the peripheral region 22 form a recess 23 which sinks downward from the peripheral region 22 toward the LED element placing region 21. A surface of the LED element placing region 21 and the peripheral region 22 functions as a reflection surface for reflecting light from the LED element 11. |
申请公布号 |
JP2014146841(A) |
申请公布日期 |
2014.08.14 |
申请号 |
JP20140092744 |
申请日期 |
2014.04.28 |
申请人 |
DAINIPPON PRINTING CO LTD |
发明人 |
ODA KAZUNORI |
分类号 |
H01L33/60;H01L23/12;H01L23/14 |
主分类号 |
H01L33/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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