发明名称 LED ELEMENT PLACING MEMBER AND LED ELEMENT PLACING SUBSTRATE AND MANUFACTURING METHOD OF THOSE, AND LED ELEMENT PACKAGE AND MANUFACTURING METHOD OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide an LED placing member and a manufacturing method of the same, and an LED element package and a manufacturing method of the same, which achieves a thin LED element package and enables control of a reflection direction of light from an LED element.SOLUTION: An LED element placing member 20 for placing an LED element 11 comprises: an LED element placing region 21 located in the center; and a peripheral region 22 located on a peripheral border of the LED element placing region 21. The LED element placing region 21 and the peripheral region 22 form a recess 23 which sinks downward from the peripheral region 22 toward the LED element placing region 21. A surface of the LED element placing region 21 and the peripheral region 22 functions as a reflection surface for reflecting light from the LED element 11.
申请公布号 JP2014146841(A) 申请公布日期 2014.08.14
申请号 JP20140092744 申请日期 2014.04.28
申请人 DAINIPPON PRINTING CO LTD 发明人 ODA KAZUNORI
分类号 H01L33/60;H01L23/12;H01L23/14 主分类号 H01L33/60
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