发明名称 3D STRUCTURED MEMORY DEVICES AND METHODS FOR MANUFACTURING THEREOF
摘要 A 3D structured nonvolatile semiconductor memory devices and methods for manufacturing are disclosed. One such device includes an n+ region at a source/drain region; a p+ region at the source/drain region; and a diffusion barrier material between the n+ region and the p+ region. The n+ region is substantially isolated from the p+ region.
申请公布号 US2014227842(A1) 申请公布日期 2014.08.14
申请号 US201414263322 申请日期 2014.04.28
申请人 Micron Technology, Inc. 发明人 Lee Ki Hong;Pyi Seung Ho;Kwon Il Young;Bin Jin Ho
分类号 H01L27/115;H01L21/223 主分类号 H01L27/115
代理机构 代理人
主权项 1. A method for forming an n+ region and a p+ region at a source/drain region, the method comprising: exposing a region of undoped channel material in a recess; forming the n+ region in the exposed region; forming a diffusion barrier material in the recess; forming the p+ region adjacent to the diffusion barrier material in the recess.
地址 Boise ID US