发明名称 |
3D STRUCTURED MEMORY DEVICES AND METHODS FOR MANUFACTURING THEREOF |
摘要 |
A 3D structured nonvolatile semiconductor memory devices and methods for manufacturing are disclosed. One such device includes an n+ region at a source/drain region; a p+ region at the source/drain region; and a diffusion barrier material between the n+ region and the p+ region. The n+ region is substantially isolated from the p+ region. |
申请公布号 |
US2014227842(A1) |
申请公布日期 |
2014.08.14 |
申请号 |
US201414263322 |
申请日期 |
2014.04.28 |
申请人 |
Micron Technology, Inc. |
发明人 |
Lee Ki Hong;Pyi Seung Ho;Kwon Il Young;Bin Jin Ho |
分类号 |
H01L27/115;H01L21/223 |
主分类号 |
H01L27/115 |
代理机构 |
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代理人 |
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主权项 |
1. A method for forming an n+ region and a p+ region at a source/drain region, the method comprising:
exposing a region of undoped channel material in a recess; forming the n+ region in the exposed region; forming a diffusion barrier material in the recess; forming the p+ region adjacent to the diffusion barrier material in the recess. |
地址 |
Boise ID US |