| 发明名称 |
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SEMICONDUCTOR DEVICE |
| 摘要 |
A semiconductor device according to the present invention has a semiconductor module 2; a cooling unit 3, the semiconductor module 2 being joined to an upper surface of the cooling unit 3, and a pipe 14, 15 for circulating a refrigerant being fixed to a side surface 20, 22 of the cooling unit 3; and a resin mold layer 4 that covers outer peripheries of the semiconductor module 2 and the cooling unit 3 . Further, a protruding portion 25, 26 that protrudes from the side surface 20, 22 of the cooling unit 3 and surrounds the pipe 14, 15 is provided on the side surface 20, 22 of the cooling unit 3. |
| 申请公布号 |
US2014225249(A1) |
申请公布日期 |
2014.08.14 |
| 申请号 |
US201214126077 |
申请日期 |
2012.04.27 |
| 申请人 |
Yoshihara Toshikazu;Tamagawa Satoshi;Oi Yasuyuki;Kobayashi Hideki |
发明人 |
Yoshihara Toshikazu;Tamagawa Satoshi;Oi Yasuyuki;Kobayashi Hideki |
| 分类号 |
H01L23/473;H01L21/50 |
主分类号 |
H01L23/473 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A semiconductor device comprising:
a semiconductor module; a cooling unit, the semiconductor module being joined to an upper surface of the cooling unit, and a pipe for circulating a refrigerant being fixed to a side surface of the cooling unit; a resin mold layer that covers outer peripheries of the semiconductor module and the cooling unit; and a protruding portion that is provided on the side surface of the cooling unit and protrudes from the side surface of the cooling unit and surrounds the pipe. |
| 地址 |
Saitama-shi JP |
