| 摘要 |
An objective of the present invention is to provide a semiconductor device which can prevent an upper electrode of an upper MIM capacitor overlapping a wire or an MMP capacitor from coming off or being peeled off from a dielectric film, and a method of manufacturing the semiconductor device. The semiconductor device includes a substrate (13); a metal film (14) partially formed on the substrate; a first dielectric film (16) having a first part (16a) on the metal film and a second part (16b) formed on the substrate to be connected to the first part; a lower electrode formed on the first part; a second dielectric film (20) having a third part (20a) on the lower electrode and a fourth part (20b) formed on the first dielectric film to be connected to the third part; an upper electrode (24) partially formed on the second dielectric film; and a reinforcing film (22) formed on the second dielectric film to contact a side surface of the upper electrode. |
