NEGATIVE PHOTOSENSITIVE RESIN COMPOSITION, AND PATTERNED CURED FILM PRODUCTION METHOD AND ELECTRONIC COMPONENT USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a resin composition in which the occurrence of residues in an opening of a patterned resin film after development is inhibited, and the adhesion of a formed patterned cured film to a substrate is excellent, and a patterned cured film production method and an electronic component using the resin composition.SOLUTION: A resin composition contains following components: (a) a polyimide precursor; (b) a compound that generates radicals by active ray irradiation; (c) a silane coupling compound having a urea bond; and (d) a solvent. A chloride ion concentration in the resin composition is 50 ppm or less.