| 主权项 |
1. A method of fabricating a light emitting device, comprising:
providing a mother substrate including a plurality of light emitting units thereon; providing a cover plate comprising a plurality of unit regions, each of the unit regions corresponding to one of the light emitting units on the mother substrate, wherein the cover plate further comprises a cutting line around each of the unit regions, a plurality of sealant regions between the cutting line and each of the unit regions, and a plurality of spacer disposing regions between the cutting line and each of the sealant regions; coating a glass frit on the cover plate in the sealant regions and the spacer disposing regions; performing a curing process so as to solidify the glass frit in the sealant regions to form a sealant and solidify the glass frit in the spacer disposing regions to form a spacer structure; disposing the cover plate on the mother substrate, and a laser process is performed to the sealant so as to bond the cover plate and the mother substrate together, wherein the laser process is not performed to the spacer structure; and performing a cutting process along the cutting line, so as to form a plurality of light emitting devices. |
