SEMICONDUCTOR MANUFACTURING APPARATUS AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

摘要

A semiconductor manufacturing apparatus according to the present embodiment includes a vacuum chamber. A stage mounts a semiconductor substrate thereon within the vacuum chamber. An electrostatic chuck fixes the semiconductor substrate onto the stage. A sensor detects a height of a surface of the semiconductor substrate fixed onto the stage by the electrostatic chuck. A processor determines whether the surface of the semiconductor substrate is distorted based on the height of the surface of the semiconductor substrate. The processor calculates correction values for a pattern transferred onto the surface of the semiconductor substrate by exposure based on the height of the surface of the semiconductor substrate when the surface of the semiconductor substrate is distorted. An exposure part exposes the surface of the semiconductor substrate to light using the correction values.

主权项

1. A semiconductor manufacturing apparatus comprising:
a vacuum chamber; a stage mounting a semiconductor substrate thereon within the vacuum chamber; an electrostatic chuck fixing the semiconductor substrate onto the stage; a sensor detecting a height of a surface of the semiconductor substrate fixed onto the stage by the electrostatic chuck; a processor determining whether the surface of the semiconductor substrate is distorted based on the height of the surface of the semiconductor substrate, and calculating correction values for a pattern transferred onto the surface of the semiconductor substrate by exposure based on the height of the surface of the semiconductor substrate when the surface of the semiconductor substrate is distorted; and an exposure part exposing the surface of the semiconductor substrate to light using the correction values.