| 摘要 |
PROBLEM TO BE SOLVED: To provide a cleaning method using ozone water, capable of using ozone water at a small amount and a low concentration, causing no uneven cleaning and requiring no complex device configuration.SOLUTION: In a cleaning method for a wafer using ozone water, the wafer is placed in a horizontal orientation in an immersion tray having a waste liquid port, the ozone water is supplied through a supply pipe installed above the wafer, the wafer is cleaned by being immersed into the ozone water in the immersion tray, and the ozone water is discharged through the waste liquid port. |
