发明名称 |
SnAgCu-BASED SOLDER POWDER AND PASTE FOR SOLDER USING THIS POWDER |
摘要 |
PROBLEM TO BE SOLVED: To provide fine solder powder which is suitable for a paste for solder capable of achieving a fine pitch, and which is excellent in fusibility and wettability during reflow.SOLUTION: Provided is SnAgCu-based solder powder having an average particle size of 5 μm or less, wherein a dried material of a solution of hydroxybenzoic acid having a melting point of 250°C or lower or its ester is adhered to the solder powder surface as an additive. |
申请公布号 |
JP2014144461(A) |
申请公布日期 |
2014.08.14 |
申请号 |
JP20130012970 |
申请日期 |
2013.01.28 |
申请人 |
MITSUBISHI MATERIALS CORP |
发明人 |
IWATA KOTARO;MURAOKA HIROKI;HISAYOSHI KANJI |
分类号 |
B23K35/14;B22F1/02;B23K35/22;B23K35/26;C22C13/00;H05K3/34 |
主分类号 |
B23K35/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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