| 摘要 |
PROBLEM TO BE SOLVED: To provide a wiring structure which electrically connects multiple terminals formed on a base substrate with multiple wiring lines formed on a wiring substrate joined to the base substrate and makes wiring formation easy even when a pitch between the multiple terminals is narrowed, and to provide a droplet discharge head including the wiring structure and a droplet discharge device.SOLUTION: The droplet discharge head includes: a diaphragm 23 where terminals 271, 272 are formed; a reservoir formation substrate 24 joined to the diaphragm 23 and including an inclined surface 247 which is a side surface, on which wiring lines 281 electrically connected with the terminals 271 are formed, and inclines relative to a plate surface; and a wiring substrate 31 joined to the diaphragm 23 and including an inclined surface 311 which is a side surface, on which wiring lines 283 electrically connected with the terminals 272 are formed, and inclines relative to a plate surface along the inclined surface 247. |
