WIRING SUBSTRATE AND METHOD OF MANUFACTURING THE SAME

摘要

A wiring substrate includes, a base wiring substrate including a first wiring layer, a first insulating layer in which the first wiring layer is buried and a first via hole is formed under the first wiring layer, and a second wiring layer formed under the first insulating layer and connected to the first wiring layer through the first via hole, and a re-wiring portion including a second insulating layer formed on the base wiring substrate and having a second via hole formed on the first wiring layer, and a re-wiring layer formed on the second insulating layer and connected to the first wiring layer through the second via hole. The re-wiring layer is formed of a seed layer and a metal plating layer provided on the seed layer, and the seed layer is equal to or wider in width than the metal plating layer.

主权项

1. A wiring substrate, comprising:
a base wiring substrate including
a first wiring layer,a first insulating layer in which the first wiring layer is buried and a first via hole is formed under the first wiring layer, anda second wiring layer formed under the first insulating layer and connected to the first wiring layer through a via conductor in the first via hole; and a re-wiring portion including
a second insulating layer formed on the base wiring substrate, the second insulating layer in which a second via hole is formed on the first wiring layer, anda re-wiring layer formed on the second insulating layer and connected to the first wiring layer through a via conductor in the second via hole,wherein, the re-wiring layer is formed of a seed layer and a metal plating layer formed on the seed layer, and a width of the seed layer is equal to or wider than a width of the metal plating layer.