SEMICONDUCTOR DEVICE, SEMICONDUCTOR PACKAGE, AND ELECTRONIC DEVICE

摘要

A semiconductor device, a semiconductor package, and an electronic device are provided. The electronic device includes a first semiconductor package disposed on a circuit substrate. A second semiconductor package is provided on the circuit substrate and spaced apart from the first semiconductor package. An insulating electromagnetic shielding structure is provided on the top and the lateral surfaces of the first semiconductor package. A conductive electromagnetic shielding structure is provided on the circuit substrate to cover the first and second semiconductor packages and the insulating electromagnetic shielding structure.

主权项

1. A semiconductor package comprising:
a package substrate; a first semiconductor chip disposed on the package substrate; and a first electromagnetic shielding structure disposed on the first semiconductor chip, wherein the first electromagnetic shielding structure includes a first polarizer having a first transmission axis, and a second polarizer having a second transmission axis different from the first transmission axis.