SEMICONDUCTOR DEVICE, METHOD OF MANUFACTURING THE SAME, AND SIGNAL TRANSMITTING/RECEIVING METHOD USING THE SEMICONDUCTOR DEVICE

摘要

A semiconductor device includes a semiconductor chip including a main surface, an internal circuit including a plurality of transistors, formed on the main surface, a bonding pad electrically connected to the internal circuit, formed on the main surface, an inductor for communicating an external device in a non-contact manner, formed on the main surface, and a seal ring formed along an outer peripheral edge of the semiconductor chip to surround the internal circuit and the bonding pad in a plan view. The inductor has a configuration to surround the internal circuit and the bonding pad in the plan view and along the seal ring. The inductor is arranged inside the seal ring.

主权项

1. A semiconductor device, comprising:
a semiconductor chip comprising a main surface; an internal circuit including a plurality of transistors, formed on said main surface; a bonding pad electrically connected to said internal circuit, formed on said main surface; an inductor for communicating an external device in a non-contact manner, formed on said main surface; and a seal ring formed along an outer peripheral edge of said semiconductor chip to surround said internal circuit and said bonding pad in a plan view, wherein said inductor has a configuration to surround said internal circuit and said bonding pad in the plan view and along said seal ring, and wherein said inductor is arranged inside said seal ring.