SUBMOUNT-FREE LIGHT EMITTING DIODE (LED) COMPONENTS AND METHODS OF FABRICATING SAME

摘要

Light emitting devices include a Light Emitting Diode (LED) chip having an anode contact and a cathode contact on a face thereof. A solder mask extends from the gap between the contacts onto one or both of the contacts. The LED chip may be mounted on a printed circuit board without an intervening submount. Related fabrication methods are also described.