| 摘要 |
PROBLEM TO BE SOLVED: To provide a simple and inexpensive method for manufacturing a large number of light-emitting devices in a short time, which has high adhesion of a lead frame and a thermosetting resin composition.SOLUTION: A method for manufacturing a light-emitting device comprises a resin package where optical reflectance in wavelength of 350 to 800 nm after thermal curing is 70% or more, and a resin part and a lead are formed on approximately the same surface in an outside surface. The method comprises: a step for sandwiching a lead frame 21, in which a notch 21a is provided, with an upper metal mold 61 and a lower metal mold 62; a step for forming a resin molding 24 in the lead frame 21 by transfer-molding a thermosetting resin 23, which contains light reflective material 26, in a metal mold 60 sandwiched by the upper metal mold 61 and the lower mold 62; and a step for cutting the resin molding 23 and the lead frame 21 along the notch 21a. |
