| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring board with an adhesive layer, in which an individualized adhesive layer is efficiently arranged with high positional and dimensional accuracy at a specific position.SOLUTION: The method of manufacturing a wiring board with an adhesive layer includes: a step A of longitudinally cutting a semiconductor packaging tape fixed to a support stand 6 by using a plurality of cutting blades whose interval is fixed, and thereby, obtaining narrow-width semiconductor packaging tapes of the same number as the number of columns of the unit, that have the same width as a length of the unit in a width direction of the semiconductor packaging tape; a step B of widening an interval of the respective narrow-width semiconductor packaging tapes by using a tape guide so as to be the same interval as that of the columns of the unit; and a step C of positioning the respective narrow-width semiconductor packaging tapes whose interval is widened on the respective columns of the unit, cutting an adhesive layer 4 in the width direction of the narrow-width semiconductor packaging tape so as to have the same length as the unit in a longitudinal direction of the narrow-width semiconductor packaging tape, and adhering the adhesive layer 4 on the unit of the semiconductor mounting package substrate while peeling a supporting film 3.</p> |
