MULTI-LAYER FLEXIBLE CIRCUIT BOARD AND PROCESS FOR PRODUCING THE SAME

摘要

The present invention provides a multi-layer flexible circuit board, comprising at least an electric circuit disposed on a vertical interval layer, wherein at least two sides of the electric circuit are covered by neighboring interval layer and another vertical interval composed layer of electric insulating material. The disclosure provides a non-pressing way to stack the multi-layer flexible circuit board, preventing fault crevice derived from a prior-known pressing way.

主权项

1. A method of manufacturing a flexible circuit board, comprising at least:
providing a flexible circuit board whose surface has a first electric circuit protruding therefrom and an empty portion which is empty with respect to the first electric circuit; coating an electric insulation layer on the surface of the flexible circuit board, such that the electric insulation layer fills up the empty portion to define a neighboring interval layer and covers the top portion of the first electric circuit to define a vertical interval layer on top of the first electric circuit; and making the electric insulation layer coat at least two sides of the first electric circuit.