发明名称 LASER JOINING APPARATUS AND LASER JOINING METHOD
摘要 Provided is a laser joining apparatus for joining a metal material and a resin housing made from a thermoplastic resin, wherein the laser joining apparatus enhances the efficiency of heat conduction and reduces the output of the laser beam. A joining apparatus that heat-joins the joint surfaces of a resin housing (7) and a metal material (3) by applying a laser to the surface of the metal material (3) on the opposite side of the joint surface, wherein the resin housing (7) and metal material (3) are positioned and fixed by an upper mold (1) and a lower mold (2) and the joint surfaces of the resin housing (7) and metal material (3) are brought into close contact by pressing the upper mold (1). At this time, the metal material (3) is preheated by a heater (8). A laser beam is applied thereafter from a hole (1a) in the upper mold (1). The efficiency of heating the metal material (3) using the laser can be enhanced, the laser output can be reduced, and the cost of joining can be vastly reduced by heating the resin housing (7) and metal material (3) to a predetermined temperature using the heater (8) and pressurizing the joint surfaces using the upper mold (1) and lower mold (2).
申请公布号 WO2014123022(A1) 申请公布日期 2014.08.14
申请号 WO2014JP51669 申请日期 2014.01.27
申请人 HITACHI, LTD. 发明人 TSUNODA, SHIGEHARU;ARAI, SATOSHI
分类号 B29C65/16;B23K26/08;B23K26/32;B23K26/60;B23K26/70 主分类号 B29C65/16
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