发明名称 |
ADJUSTING METHOD, SUBSTRATE TREATING METHOD, SUBSTRATE TREATING DEVICE, EXPOSURE DEVICE, INSPECTION DEVICE, MEASUREMENT INSPECTION SYSTEM, TREATING DEVICE, COMPUTER SYSTEM, AND INFORMATION RECORDING MEDIUM |
摘要 |
<p>When a host issues an analysis order that specifically instructs the analytical contents to an analytical apparatus (step 401), the analytical apparatus collects two types of measurement and/or inspection results from a measurement and/or inspection instrument (steps 403 to 409), and in step 411, the analytical apparatus analyzes the measurement and/or inspection results and optimizes processing conditions of a series of processes related to wafer W. In step 411, data related to a processing state of a processing apparatus is acquired from the processing apparatus as needed. In step 413, the measurement and/or inspection results and the optimization results are accumulated in a database, and the optimization results are transmitted to various processing apparatuses (including the measurement and/or inspection instrument). After that, the analytical apparatus sends a processing end notice to the host (step 417).</p> |
申请公布号 |
KR101430271(B1) |
申请公布日期 |
2014.08.14 |
申请号 |
KR20087022630 |
申请日期 |
2007.02.16 |
申请人 |
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发明人 |
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分类号 |
G03F7/20;H01L21/02;H01L21/027;H01L21/66 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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