SYSTEMS AND METHODS FOR CONTROLLING SURFACE PROFILES OF WAFERS SLICED IN A WIRE SAW

摘要

Systems (100) and methods are disclosed for controlling the surface profiles of wafers cut in a wire saw machine (103). The systems and methods described herein are generally operable to alter the nanotopology of wafers sliced from an ingot (102) by controlling the shape of the wafers. The shape of the wafers is altered by changing the temperature and/or flow rate of a temperature-controlling fluid circulated in fluid communication with bearings (114) supporting wire guides (106) of the saw. Different feedback systems can be used to determine the temperature of the fluid necessary to generate wafers having the desired shape and/or nanotopology.