METHODS AND APPARATUS FOR CLEANING FLIP CHIP ASSEMBLIES

摘要

An apparatus for cleaning flip chip assemblies is provided. The apparatus comprises: a chuck assembly; a motor coupled to the chuck assembly by a spindle; at least one carrier for holding flip chips; at least one spray nozzle for directing DIW, a cleaning solution, a gas or a vapor. Apparatus of the invention further provides a method for cleaning flip chip assemblies. The method comprises: loading at least one flip chip to the flip chip carriers; rotating the chuck assembly at a rotation speed; flowing DIW for rinsing the flip chips; flowing a cleaning solution for removing the contaminants; applying ultrasonic/megasonic energy to the flip chips; blowing a gas or a vapor via the spray nozzles for drying the flip chips; bringing the flip chips out of the flip chip carriers.

主权项

1. An apparatus for cleaning flip chip assemblies, comprising:
a chuck assembly; a motor coupled to the chuck assembly by a spindle; at least one carrier for holding a flip chip; at least one spray nozzle for directing DIW, a cleaning solution, a gas or a vapor.