发明名称 PASSIVATION LAYER REMOVAL BY DELIVERING A SPLIT LASER PULSE
摘要 Embodiments of the present invention generally provide methods for forming features or holes in a passivation layer without damaging the underlying solar cell substrate. A source laser beam is split into a first laser beam and a second laser beam. The first laser beam is modified to have a different wavelength than the source laser beam. The second laser beam is delayed for a predetermined time, and the first and second laser beams are delivered to a surface of the substrate.
申请公布号 US2014227820(A1) 申请公布日期 2014.08.14
申请号 US201313763295 申请日期 2013.02.08
申请人 Applied Materials, Inc. 发明人 FRANKLIN Jeffrey L.;ZHENG Yi
分类号 H01L31/18 主分类号 H01L31/18
代理机构 代理人
主权项 1. A method for forming a feature on a substrate, comprising: receiving a source laser beam having a first wavelength; splitting the source laser beam to form a first laser beam and a second laser beam; modifying the first laser beam so that the first laser beam has a second wavelength; delaying the second laser beam for a predetermined time; and delivering the first and second laser beams to a surface of the substrate.
地址 Santa Clara CA US