发明名称 |
PASSIVATION LAYER REMOVAL BY DELIVERING A SPLIT LASER PULSE |
摘要 |
Embodiments of the present invention generally provide methods for forming features or holes in a passivation layer without damaging the underlying solar cell substrate. A source laser beam is split into a first laser beam and a second laser beam. The first laser beam is modified to have a different wavelength than the source laser beam. The second laser beam is delayed for a predetermined time, and the first and second laser beams are delivered to a surface of the substrate. |
申请公布号 |
US2014227820(A1) |
申请公布日期 |
2014.08.14 |
申请号 |
US201313763295 |
申请日期 |
2013.02.08 |
申请人 |
Applied Materials, Inc. |
发明人 |
FRANKLIN Jeffrey L.;ZHENG Yi |
分类号 |
H01L31/18 |
主分类号 |
H01L31/18 |
代理机构 |
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代理人 |
|
主权项 |
1. A method for forming a feature on a substrate, comprising:
receiving a source laser beam having a first wavelength; splitting the source laser beam to form a first laser beam and a second laser beam; modifying the first laser beam so that the first laser beam has a second wavelength; delaying the second laser beam for a predetermined time; and delivering the first and second laser beams to a surface of the substrate. |
地址 |
Santa Clara CA US |