发明名称 |
SURFACE MODIFIER FOR POLYIMIDE RESIN AND SURFACE-MODIFYING METHOD FOR POLYIMIDE RESIN |
摘要 |
The present invention relates to a polyimide resin surface modifier which modifies the surface of a polyimide resin to permit easy absorption of metal ions, and a surface-modifying method for polyimide resins using the same. The surface modifier contains an alkali component, an organic solvent having hydroxy groups and a boiling point of 120° C. or higher, and a water content of 0-10% by weight. The surface-modifying method includes a printing process wherein a predetermined pattern is printed on the surface of a polyimide resin substrate using the polyimide resin surface modifier, an organic solvent-removing process wherein an organic solvent in the polyimide resin surface modifier pattern-printed on the surface of said polyimide resin substrate is removed and a water-treatment process wherein said polyimide resin surface modifier after removing the organic solvent is brought into contact with water. |
申请公布号 |
US2014227446(A1) |
申请公布日期 |
2014.08.14 |
申请号 |
US201414176309 |
申请日期 |
2014.02.10 |
申请人 |
SEIREN CO., LTD. |
发明人 |
BAMBA Akimitsu;ARITA Takuya;HAYASHI Hiroyuki;KUGIMIYA Kouichi |
分类号 |
H05K3/38 |
主分类号 |
H05K3/38 |
代理机构 |
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代理人 |
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主权项 |
1. A polyimide resin surface modifier which contains an alkali component and an organic solvent having hydroxy groups and a boiling point of 120° C. or higher, wherein the water content is 0-10% by weight. |
地址 |
Fukui JP |