发明名称 SURFACE MODIFIER FOR POLYIMIDE RESIN AND SURFACE-MODIFYING METHOD FOR POLYIMIDE RESIN
摘要 The present invention relates to a polyimide resin surface modifier which modifies the surface of a polyimide resin to permit easy absorption of metal ions, and a surface-modifying method for polyimide resins using the same. The surface modifier contains an alkali component, an organic solvent having hydroxy groups and a boiling point of 120° C. or higher, and a water content of 0-10% by weight. The surface-modifying method includes a printing process wherein a predetermined pattern is printed on the surface of a polyimide resin substrate using the polyimide resin surface modifier, an organic solvent-removing process wherein an organic solvent in the polyimide resin surface modifier pattern-printed on the surface of said polyimide resin substrate is removed and a water-treatment process wherein said polyimide resin surface modifier after removing the organic solvent is brought into contact with water.
申请公布号 US2014227446(A1) 申请公布日期 2014.08.14
申请号 US201414176309 申请日期 2014.02.10
申请人 SEIREN CO., LTD. 发明人 BAMBA Akimitsu;ARITA Takuya;HAYASHI Hiroyuki;KUGIMIYA Kouichi
分类号 H05K3/38 主分类号 H05K3/38
代理机构 代理人
主权项 1. A polyimide resin surface modifier which contains an alkali component and an organic solvent having hydroxy groups and a boiling point of 120° C. or higher, wherein the water content is 0-10% by weight.
地址 Fukui JP