| 发明名称 |
WAFER TRANSFER BLADE AND WAFER TRANSFER APPARATUS HAVING THE SAME |
| 摘要 |
A wafer transfer blade including a body including metal oxide and configured to support a wafer, and an adsorbing part on the body, the adsorbing part having at least one therein and configured to apply vacuum pressure to attach the wafer on the body may be provided. The body may include metal oxide to prevent static electricity. |
| 申请公布号 |
US2014227072(A1) |
申请公布日期 |
2014.08.14 |
| 申请号 |
US201414178392 |
申请日期 |
2014.02.12 |
| 申请人 |
Samsung Electronics Co., Ltd. |
发明人 |
LEE Dong-Yoon;MUN Jun-Young;PARK Dong-Il;JUNG Suk-Yong;HWANG Bo-Young |
| 分类号 |
H01L21/683;B25J15/00;B25J15/06 |
主分类号 |
H01L21/683 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A wafer transfer blade comprising:
a body configured to support a wafer, the body including metal oxide and at least one first vacuum hole defined therein, and the first vacuum hole configured to apply vacuum pressure therethrough such that the wafer is attached to the body. |
| 地址 |
Suwon-Si KR |
