发明名称 METHOD FOR CONNECTING A MICROCIRCUIT TO ACCESSIBLE CONDUCTIVE AREAS IN A SUPPORT
摘要 The invention concerns a method for connecting conductive pads (9) of a micromodule (2) to accessible connection areas (3a, 3b) of a support (1) of a portable object (100), comprising the following steps of: - providing or producing a body 1 of the portable object comprising a recess (11) for receiving the micromodule and connection areas in the recess, said recess opening at the surface of the body and being defined at the surface of the body by a first periphery (P1), - producing a micromodule comprising conductive pads (9) on a front face, defined by a second periphery P2 substantially corresponding to first periphery P1, and connection portions (10) folded towards a rear face of the micromodule opposite the front face, - inserting the module into the recess, said connection portions being brought into electrical connection with the respective connection areas (3a, 3b) thereof. The method is characterised in that said connection areas extend in said recess perpendicular to a direction of insertion of the micromodule into the recess. The invention also concerns the portable object obtained.
申请公布号 WO2014122009(A1) 申请公布日期 2014.08.14
申请号 WO2014EP51146 申请日期 2014.01.21
申请人 GEMALTO SA 发明人 OTTOBON, STÉPHANE;DOSSETTO, LUCILE;SEBAN, FRÉDÉRICK;AUDOUARD, LAURENT
分类号 G06K19/077 主分类号 G06K19/077
代理机构 代理人
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