| 摘要 |
In the present invention, a laser beam is focused into an annular shape and irradiated on a beam-focus location within a substrate thickness range; and, in a process in which the beam-focus location is shifted in the substrate thickness direction and in the substrate planar direction, the beam-focus location is shifted so that the center of the ring-shaped beam-focus location moves in a circular manner. It is thereby possible to reduce the cost of the apparatus and the process treatment time. |
