| 摘要 |
PROBLEM TO BE SOLVED: To achieve a semiconductor device which reduces the need for adjustment after a soldering process and reduces a disposal loss of the semiconductor device, and which has high productivity by inhibiting solder cracks or at least and substantially reducing a depth of the crack.SOLUTION: A semiconductor device according to the present embodiment comprises: an insulating substrate which has conductive patterns on a surface and a rear face, respectively, and which is bonded to a heat spreader via solder; and a power semiconductor element bonded to on the conductive pattern on the surface side of the insulating substrate, in which the heat spreader has a plurality of first dimples on a solder bonded surface with the insulating substrate, which are arranged along a peripheral part of the insulating substrate. |
