Metal Filling Device

摘要

A metal filling apparatus 1 fills a molten metal M into a minute space formed on a surface of a semiconductor wafer K. The metal filling apparatus 1 has a processor body 2 having a processing chamber 5 in which the semiconductor wafer K is held, a molten metal supply mechanism 10, and a molten metal recovery mechanism 20. The molten metal supply mechanism 10 includes a supply tank 11 in which the molten metal M is stored, a supply pipe 13 connected to the processing chamber 5 of the processor body 11 and the supply tank 11, and a supplier 12 interposed in the supply pipe 13 and supplying the molten metal M in the supply tank 11 into the processing chamber 5 through the supply pipe 13, and the molten metal recovery mechanism 20 recovers the molten metal M supplied into the processing chamber 5 from the processing chamber 5.

主权项

1. A metal filling apparatus filling a molten metal into a minute space formed on a surface of an object to be processed to have an opening in said object surface, comprising:
a processor body equipped with a processing chamber in which the object to be processed is held; and a molten metal supply mechanism including a supply tank in which a metal in a molten state is stored, a supply pipe one end of which is connected to the supply tank and the other end of which is connected to the processing chamber of the processor body, and a supplier which is interposed in the supply pipe and which supplies the molten metal in the supply tank into the processing chamber through the supply pipe; and a molten metal recovery mechanism recovering the molten metal supplied into the processing chamber.