| 摘要 |
A semiconductor device is disclosed. The semiconductor device has a semiconductor chip, an island having an upper surface to which the semiconductor chip is bonded, a lead disposed around the island, a bonding wire extended between the surface of the semiconductor chip and the upper surface of the lead, and a resin package sealing the semiconductor chip, the island, the lead, and the bonding wire, while the lower surface of the island and the lower surface of the lead are exposed on the rear surface of the resin package, and the lead is provided with a recess concaved from the lower surface side and opened on a side surface thereof. |
| 主权项 |
1. A semiconductor device comprising:
a semiconductor chip; an island having an upper surface to which the semiconductor chip is bonded; a plurality of leads arranged around the island; a bonding wire extending between the surface of the semiconductor chip and the upper surface of the lead; and a resin package collectively sealing the semiconductor chip, the island, the leads and the bonding wire; wherein the lower surface of the island and the lower surface of the leads are exposed on the rear surface of the resin package, wherein the island has an area defined by four sides, each of which is not facing any sides of the resin package, in bottom plan view; wherein the leads are arranged on corners of the semiconductor device in bottom plan view, respectively; wherein each of the leads has a side facing the side of the island; wherein the semiconductor device further comprises a facing portion including the side of the island and the side of the lead facing each other; and wherein the facing portion has an etched portion keeping the side of the island and the side of the lead selectively non-parallel. |
