| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin composition which is excellent in adhesive strength, quick curability, and moisture resistance, and to provide a highly reliable semiconductor device which is excellent in solder crack resistance when using the resin composition as a die attach material for a semiconductor. ! SOLUTION: The resin composition contains: (A) a bismaleimide compound having a polyalkylene oxide skeleton; (B) an allyl ester compound having a polyalkylene oxide skeleton; (C) a (meth)acrylate having a hydroxycarbonyl group; (D) a (meth)acrylate having a hydroxyl group; (E) a radical initiator; and (F) a filler. ! COPYRIGHT: (C)2014,JPO&INPIT |
